| Type |
CPU / Microprocessor |
| Market segment |
Desktop |
| Family |
Intel Core i7 |
| Model number |
i7-870 |
| CPU part numbers |
- BV80605001905AI is an OEM/tray microprocessor
- BX80605I7870 is a boxed processor with fan and heatsink (English version)
- BXC80605I7870 is a boxed processor with fan and heatsink (Chinese version)
|
| Frequency |
2933 MHz |
| Turbo frequency |
3600 MHz (1 core)
3467 MHz (2 cores)
3200 MHz (3 or 4 cores) |
| Bus speed |
2.5 GT/s DMI |
| Clock multiplier |
22 |
| Package |
1156-land Flip-Chip Land Grid Array (FC-LGA8) |
| Socket |
Socket 1156 / H1 / LGA1156 |
| Size |
1.48" x 1.48" / 3.75cm x 3.75cm |
| Weight |
0.9oz / 24.8g |
| Introduction date |
Sep 8, 2009 |
| End-of-Life date |
Last order date is June 29, 2012
Last shipment date for tray processors is December 7, 2012 |
| Price at introduction |
$562 |
| S-spec numbers |
| |
ES/QS processors |
Production processors |
| Part number |
Q3AJ |
SLBJG |
| BV80605001905AI |
+ |
+ |
| BX80605I7870 |
|
+ |
| BXC80605I7870 |
|
+ | |
| Architecture / Microarchitecture |
| Microarchitecture |
Nehalem |
| Processor core |
Lynnfield |
| Core stepping |
B1 (Q3AJ, SLBJG) |
| CPUID |
106E5 (SLBJG) |
| Manufacturing process |
0.045 micron
774 million transistors |
| Die size |
296mm2 |
| Data width |
64 bit |
| The number of cores |
4 |
| The number of threads |
8 |
| Floating Point Unit |
Integrated |
| Level 1 cache size |
4 x 32 KB 4-way set associative instruction caches
4 x 32 KB 8-way set associative data caches |
| Level 2 cache size |
4 x 256 KB 8-way set associative caches |
| Level 3 cache size |
8 MB 16-way set associative shared cache |
| Physical memory |
16 GB |
| Multiprocessing |
Uniprocessor |
| Features |
- MMX instructions
- SSE / Streaming SIMD Extensions
- SSE2 / Streaming SIMD Extensions 2
- SSE3 / Streaming SIMD Extensions 3
- SSSE3 / Supplemental Streaming SIMD Extensions 3
- SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
- EM64T / Extended Memory 64 technology / Intel 64
- HT / Hyper-Threading technology
- VT-x / Virtualization technology
- VT-d / Virtualization for directed I/O
- NX / XD / Execute disable bit
- TXT / Trusted Execution technology
- TBT / Turbo Boost technology
|
| Low power features |
- Thread C1/C1E, C3 and C6 states
- Core C1/C1E, C3 and C6 states
- Package C1/C1E, C3 and C6 states
- Enhanced SpeedStep technology
|
| Integrated peripherals / components |
| Integrated graphics |
None |
| Memory controller |
The number of controllers: 1
Memory channels: 2
Supported memory: DDR3-1066, DDR3-1333
Maximum memory bandwidth (GB/s): 21.3 |
| Other peripherals |
- Direct Media Interface
- PCI Express 2.0 interface
|
| Electrical / Thermal parameters |
| V core |
0.65V - 1.4V |
| Minimum/Maximum operating temperature |
5°C - 72.7°C |
| Maximum power dissipation |
189.78 Watt (peak)
160.08 Watt (sustained) |
| Thermal Design Power |
95 Watt |
| Notes on Intel Core i7-870 |
- The processor has the following security, data protection and/or software features: Intel vPro technology.
|
